约翰逊科技致力于采用低温共烧陶瓷(LTCC)技术生产制造无线通信领域各类特定应用元件,例如分频开关模块,压控振荡器(VCO), 功率放大器(PA)和高度集成射频模块。约翰逊科技具备丰富的专业技术,生产过程中采用内部开发LTCC带材系统。

 

LTCC Module Foundry Service for wireless communication such as Diplexer Switch, VCO, PA and highly integrated RF modules
LTCC Custom Module Foundry Service  Unpatterned Thin Film Substrates schematic LTCC Low Temperature Co-fired Ceramic Unpatterned Thin Film Substrates design